Current methods for manufacturing electronics create products that are thick, heavy, rigid, and expensive, with a heavy environmental footprint.
Terepac was founded in 2004 to commercialize breakthrough innovations which overcome these limitations through an entirely new paradigm for assembly, integration and packaging of electronic products. The company’s revolutionary technologies enable sophisticated microelectronics to be printed on flexible substrates at a fraction of the size and cost of creating conventional circuits. Entire devices with microprocessors, memory, and sensors can be reduced to less than a millimeter square, thinner than paper, and flexible enough to bend around a pencil – with no sacrifice in performance.
As a result, these tiny electronics can be used in ways previously not thought physically or economically feasible. They also allow existing devices, components and products to be transformed into small, flexible forms which were previously impractical or even impossible. No other existing process can effectively handle, assemble and connect chips and devices of this size, flexibility and compactness.
Terepac will play a critical role in making electronics truly pervasive by transforming both the form and process of their delivery. The company aims to define the standard for innovation in microelectronics.